| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of processing a semiconductor wafer that has less remains of an adhesive caused by an adhesive tape for semiconductor processing even when a semiconductor wafer having a circuit formed thereon is processed. Ž<P>SOLUTION: In the method of processing a semiconductor wafer using an adhesive tape for semiconductor processing, an adhesive caused by the semiconductor processing adhesive tape can be prevented from remaining by protecting a circuit formed on the semiconductor wafer with a protective layer made of water-soluble polymer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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