| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which is superior in radiation performance when a semiconductor element generates heat, effectively relieves stress due to deformation of a cooler forming the power module and suppresses stress occurring in an insulating substrate and the semiconductor element to the minimum. SOLUTION: In the power module 10, the semiconductor element 5 is loaded on one side of the insulating substrate 4 (DBA), and the cooler 6 is installed on the other side of the insulating substrate 4. A green compact 7 is inserted between the other side of the insulating substrate 4 and the cooler 6. COPYRIGHT: (C)2010,JPO&INPIT |
