发明名称 |
LOW-ADHESIVE MATERIAL AND ITS MANUFACTURING METHOD, MOLDING MOLD AND ITS MANUFACTURING METHOD, ANTIFOULING MATERIAL AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a low-adhesive material having low adhesion to a substance with basicity or thermosetting resin, a molding mold having high mold releasability, and an antifouling material having antifouling property against smudge with basicity or smudge comprising thermosetting resin. SOLUTION: The molding mold 8 which is used for forming curable resin 14, 15 by setting fluid resin 13 with basicity is composed of a low adhesive material 7 having low adhesion to a substance with basicity or thermosetting resin. The low-adhesive material 7 has a base material 3 composed of Y<SB>2</SB>O<SB>3</SB>and a functional layer 9 provided near the surface of that base material 3 and containing nitrogen, and is manufactured by making nitrogen contained near the surface of the base material 3 using an ion implantation method. The content of the nitrogen is in excess of 10<SP>18</SP>atoms/cm<SP>3</SP>and less than 10<SP>22</SP>atoms/cm<SP>3</SP>. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2009226775(A) |
申请公布日期 |
2009.10.08 |
申请号 |
JP20080075781 |
申请日期 |
2008.03.24 |
申请人 |
TOWA CORP;JAPAN FINE CERAMICS CENTER |
发明人 |
KUNO KOKI;AZUMA DAISUKE;KISHIMOTO TOMOKO;NOGUCHI YOSHINORI;FUJIWARA KUNIHIKO;KITAOKA SATOSHI;KAWASHIMA NAOKI;NAKAHIRA KENJI |
分类号 |
B29C33/38 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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