发明名称 SOLDER BY NUMBERS, A METHOD AND SYSTEM FOR POPULATING PRINTED CIRCUIT BOARDS
摘要 An electronic circuit assembly comprises a printed circuit board including a plurality of electrically-conductive traces disposed on at least one face of the printed circuit board and a circuit schematic layout. The plurality of electrically-conductive traces is configured to mount and electrically couple a plurality of types of electronic devices. The circuit schematic layout includes a map arranged similarly to the layout of the plurality of electrically-conductive traces disposed on the at least one face of the printed circuit board. A plurality of layout column markers and a plurality of layout row markers and a plurality of color-coded regions are marked directly onto the map. Each color of the plurality of color-coded regions is indicative of a particular one of the plurality of types of electronic devices.
申请公布号 US2009250246(A1) 申请公布日期 2009.10.08
申请号 US20080099056 申请日期 2008.04.07
申请人 YAUNG ANDREW;GREENBERG NEAL S 发明人 YAUNG ANDREW;GREENBERG NEAL S.
分类号 H05K1/00 主分类号 H05K1/00
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