| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition exhibiting high sensitivity without respect to a standing time from exposure to post-exposure baking, causing little reduction in film thickness in development, and having excellent chemical resistance after curing, and to provide a thermal cross-linking agent used for the composition. <P>SOLUTION: In the cross-linking agent, a part or the whole of phenolic hydroxy groups in a compound having hydroxymethyl groups and/or alkoxymethyl groups, and the phenolic hydroxy groups is protected by a group separable by a reaction of heat, an acid or a base. <P>COPYRIGHT: (C)2010,JPO&INPIT |
