| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of improving mounting strength of an electronic component with projection of a lead terminal from a printed wiring board restricted. Ž<P>SOLUTION: By filling a jointing material such as solder 30 between a lead terminal 26 inserted in a through-hole 22 and the through-hole 22, the lead terminal 26 is jointed to a circuit board 13 provided with the through-hole 22. Although formation of a solder fillet is reduced by restricting the projection of the solder 30, the joint surface area between the solder 30 and the lead terminal 26 can be increased by forming cutout parts 26c. By forming the cutout parts 26c, for instance, tensile strength in a direction shown by an arrow A in fig. 4 is improved, and coming-off of the lead terminal 26 from the circuit board 13 can be prevented. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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