| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide hyperfine-grained base metal powder, and a method for mass production of such hyperfine-grained base metal powder, and an electronic component, wherein the obtained hyperfine-grained base metal powder is used for a conductive paste, so that a conductor film of a thin layer is formed on the surface of an insulator and the occurrence of a defect such as delamination is suppressed. <P>SOLUTION: The base metal powder which consists essentially of a base metal, and has mean grain size of 5 to 30 nm, wherein in the X-ray diffraction pattern, the diffraction intensity of stronger of the main peak of the hexagonal close-packed structure(hcp) of the base metal and the main peak of the oxide of the base metal is≤10% of the diffraction intensity of the main peak of the cubic close-packed structure (fcc), is obtained, then the conductive paste is prepared from the base metal powder, and the electronic component is produced by printing the surface of the insulator with the conductive paste to form into the sintered body. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
