发明名称 Static ram cell with trench pull-down transistors and buried-layer ground plate.
摘要 <p>Disclosed is a (4T-2R) SRAM cell and method which achieves a much reduced cell area through the combined use of vertical trench pull-down n-channel transistors and a buried-layer ground plate. The reduced cell area allows the fabrication of a higher density SRAM for a given set of lithographic rules. The cell structure also allows the implementation of a (6T) SRAM cell with non-self-aligned poly-silicon p-channel pull-up transistors without appreciably enlarging the cell area.</p>
申请公布号 EP0297350(B1) 申请公布日期 1994.09.07
申请号 EP19880109475 申请日期 1988.06.14
申请人 INTEGRATED DEVICE TECHNOLOGY, INC. 发明人 HSU, FU-CHIEH
分类号 H01L21/74;H01L21/8244;H01L23/532;H01L27/11;H01L29/78;(IPC1-7):H01L27/11 主分类号 H01L21/74
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