| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high-reliability electronic circuit board by preventing malfunction of an LSI due to temperature rise associated with mounting of a heat generation component; and an electronic circuit using the same. <P>SOLUTION: Digital components each having a large calorific value are mounted on a first surface, analog components each having a small calorific value and a connection part are mounted on a second surface facing the first surface, and the second surface becomes a form facing a mounting board, whereby heat can be prevented from being accumulated in this electronic circuit board. The heat generated from the digital components is efficiently radiated from the first surface of the board, influence by the heat is suppressed, and thereby a high-reliability electronic circuit can be provided. Heat generation components out of the analog components are arranged by avoiding positions planarly facing the digital components, and thereby the influence of the heat transmitted through the board can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
