| 摘要 |
<p>A liquid solvent abutting unit capable of accelerating a reaction of adhesive member by liquid solvent between perforated support plate and wafer. The liquid solvent abutting unit (1) comprises supply part (103) for supplying a liquid solvent onto a surface of support plate; retention part (10) for retaining the supplied liquid solvent in hole formation regions of the support plate surface; recovery part (104) for recovery of the liquid solvent retained in the hole formation regions; and vibration part (13) for vibrating the liquid solvent.</p> |
