| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition with which a polyimide film on a semiconductor substrate is polished at high speed while damage such as a scratch is suppressed and which achieves high flatness after the polishing, and to provide a chemical mechanical polishing method using the same. <P>SOLUTION: In semiconductor device manufacture, the polishing composition is used for chemical mechanical polishing on a film substrate composed principally of a polyimide film substrate or polyimide, and contains (a) an oxidant and (b) abrasive grains, and preferably contains (c) a PH adjuster. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
