| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal mask such that the thickness of solder paste printed on a printed wiring board can be adjusted by openings. Ž<P>SOLUTION: The metal mask 1 has the openings 2a and 2b formed at positions corresponding to soldering pads 5a and 5b formed on the printed wiring board 4. A plurality of protrusions 3 protruding toward the printed circuit board 4 are formed at peripheries of the openings 2a and 2b through punching processing. When the metal mask 1 and printed wiring board 4 are printed one over the other, the opening 2b of the metal mask 1 which corresponds to a gull wing lead 12 flexes downward by being depressed by a squeeze 8 and comes into contact with the printed wiring board 4, so the solder paste 9b is printed by the thickness of the metal mask 1. The opening 2a which corresponds to a bottom surface electrode 11 floats from the printed wiring board 4 because of the protrusion 3 provided at its periphery, so that the solder paste 9a is printed more by the flotation height. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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