| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin package which is reduced in the filling amount of a protection member even if the protection member having high viscosity is filled. Ž<P>SOLUTION: A rugged portion 34 is formed at a step 33 between a first bottom 14 and a second bottom 15 of the resin package 11. A first protection member 31 which is filled spreads entirely in the resin package 11 speedily by the capillarity of the uneven portion 34 even if having high viscosity. Consequently, the filling time of the first protection member 31 is shortened to reduce the filling amount of the first protection member 31. Thus, the filling amount of the first protection member 31 is reduced to reduce the thickness of the first protection member 31 present below a bonding wire 25 connecting a circuit chip 21 and a sensor chip 22 to each other. Consequently, stress applied to the bonding wire 25 is reduced by, for example, the expansion or contraction of the first protection member 31. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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