| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching liquid which can form copper wiring free from undercut and hollowing and also having excellent linearity, and to provide a method for forming copper wiring using the same. <P>SOLUTION: In the etching liquid for copper comprising acid, a second copper ion source, tetrazoles and water, a polymer having a functional group expressed by formula (I) in the structural unit is included. <P>COPYRIGHT: (C)2010,JPO&INPIT |
