发明名称 STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT ON SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a structure for mounting an electronic component on a substrate in which terminal plates protruding from the side of the electronic component and bent toward the substrate can easily be connected/fixed on the substrate. Ž<P>SOLUTION: The structure includes the electronic component 10 which varies its electric output by turning a shaft 120 protruding from the interior and/or pressing the shaft 120 in the axial direction, and the substrate 200. The electronic component 10 is fixed on the substrate 200 when the shaft 120 of the electronic component 10 is inserted through a through-hole 201 installed in the substrate 200. The terminal plates 25, 39 protruding from the side of the electronic component 10 is bent toward the substrate 200, and while front ends of the bent terminal plates 25, 39 are held in a terminal plate holding part 55 installed so as to protrude from the side of the electronic component 10, and are connected to terminal plate connection parts 205 installed on the substrate 200. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009224805(A) 申请公布日期 2009.10.01
申请号 JP20090159600 申请日期 2009.07.06
申请人 TEIKOKU TSUSHIN KOGYO CO LTD 发明人 TOYODA TERUYUKI;HAYASHI NAOKI
分类号 H01C10/20 主分类号 H01C10/20
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