A semiconductor package which comprises a base frame and a wiring substrate mounted on the base frame. The base frame comprises two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate comprises electric wiring tracks providing the electric connection between the first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
申请公布号
WO2009095486(A3)
申请公布日期
2009.10.01
申请号
WO2009EP51089
申请日期
2009.01.30
申请人
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW;KATHOLIEKE UNIVERSITEIT LEUVEN;UNIVERSITEIT GENT;LIMAYE, PARESH;VANFLETEREN, JAN;BEYNE, ERIC