| 摘要 |
PURPOSE: An apparatus and a method for treating a substrate are provided to improve a discharging ability of a particle inside solution by generating an eddy of an optimum size around a retention supporting part of a lifter inside a treating tube. CONSTITUTION: An apparatus for treating a substrate includes a treating tube(1), a lifter, a bottom nozzle(11), a top nozzle(13), and a control unit. The treating tube undercurrents a treating solution. The lifter includes a retention supporting part(7) for supporting the substrate. The bottom nozzle is installed in both sides of a bottom part of the treating tube, and supplies the treating solution. The top nozzle is installed in a top part of the bottom nozzle, and supplied the treating solution toward the retention supporting part of the lifter. The control unit controls a flow rate with the top nozzle and the bottom nozzle.
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