发明名称 |
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PARTIALLY CURED EPOXY FILLERS |
摘要 |
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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申请公布号 |
US2009242109(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20080059031 |
申请日期 |
2008.03.31 |
申请人 |
NALLA RAVI;BEHIR OMAR;JOMAS HOUSSAIN |
发明人 |
NALLA RAVI;BEHIR OMAR;JOMAS HOUSSAIN |
分类号 |
B32B38/04;B32B5/16;B32B7/12 |
主分类号 |
B32B38/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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