| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical device for dividing the optical device wafer where a plurality of the optical devices are formed on the surface of a substrate along a street for partitioning the plurality of the optical devices and efficiently joining a heat sink to each device. <P>SOLUTION: The method of manufacturing the optical device includes: a heat sink material groove formation process for forming a groove with a depth corresponding to a finish thickness of the heat sink at a position corresponding to a street for partitioning the plurality of the optical devices on the surface of a heat sink material; a heat sink material joining process for joining the surface of the optical device layer of the optical device wafer to that of the heat sink material while allowing them to face each other for joining via a junction metal layer; the optical device wafer dividing process for cutting the wafer along the street for dividing into each optical device; a protective member sticking process for sticking a protection member to the rear surface of the substrate of the wafer; and a heat sink material dividing process for grinding the rear surface of the heat sink material to expose the grooves to the rear surface to thereby divide the heat sink material into heat sinks corresponding to each optical device. <P>COPYRIGHT: (C)2010,JPO&INPIT |
