| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a precision piezoelectric device in which an insulation film is accurately formed on only at a required part of the internal surface of a package, and to provide a method of manufacturing the piezoelectric device. Ž<P>SOLUTION: An inner periphery on an upper surface of a wall section 2b of a package 2 has an incline section 2c, and the incline section 2c is a surface not joined to a lid member 4. The incline section 2c is an incline inclining toward a bottom section 2a of the package 2, and the incline is flat. Since the package 2 is made of a silicon material, the insulation film 9 is formed on the inner surface of a cavity and the outer surface of the bottom section 2a of the package 2. The insulation film 9 on the inner surface of the cavity is successively formed from one portion of the incline section 2c onto the inner-wall and inner-bottom surfaces of a cavity C. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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