发明名称 ELECTRODE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS
摘要 PURPOSE: An electrode structure and substrate processing apparatus are provided to increase the electron density at the peripheral part of the substrate. CONSTITUTION: An electrode structure and substrate processing apparatus is arranged within the process chamber. The electrode structure is faced to the substrate mounted in the main chuck within the process chamber. The electrode structure includes the inner electrode(34), and the outer electrode(35). The inside electrode is faced to the central part of a substrate. The outer electrode is faced to the peripheral part of a substrate. In the inner electrode, the first DC power supplies are connected. The second DC power supplies are connected to the outer electrode. The outer electrode has the first plane(35a), and the second face(35b) inclined to the first plane.
申请公布号 KR20090103751(A) 申请公布日期 2009.10.01
申请号 KR20090024901 申请日期 2009.03.24
申请人 发明人
分类号 H01L21/205;H01L21/3065 主分类号 H01L21/205
代理机构 代理人
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