SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a semiconductor device high in productivity; and a manufacturing method of the semiconductor device.

SOLUTION: This semiconductor device 1a includes: a support substrate 10; a plurality of wires 12 selectively arranged on a principal surface of the support substrate 10; semiconductor elements 20a and 20b mounted on the support substrate 10; a semiconductor element 21 controlling the semiconductor elements 20a and 20b; and a plurality of conductive patterns 40 fixed to a wire support base material 30 arranged to face the principal surface of the support substrate 10, and having a flexural structure. The semiconductor elements 20a and 20b and the wires 12 are electrically connected to one another through one or more conductive patterns 40. According to such a semiconductor device 1a, productivity of the semiconductor device is improved.

COPYRIGHT: (C)2010,JPO&INPIT