| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method capable for efficiently joining a heat sink to a wafer where a plurality of optical devices are formed. <P>SOLUTION: In the method of manufacturing the optical device, an optical device wafer where a the plurality of the optical devices are formed on the surface of a substrate by an optical device layer is divided along a street for partitioning the plurality of the optical devices, and a heat sink is joined to each optical device. In the method of manufacturing the optical device, the heat sink of which size is equivalent to that of the optical device is stored in a plurality of storage chambers of a heat sink case having the plurality of the storage chambers partitioned by a partition wall corresponding to the street while the surface faces up, the surface of the optical device layer and the surfaces of a plurality of heat sinks stored in the plurality of the storage chambers in a heat sink arrangement tool are joined via a junction metal layer by allowing the street to face the partition wall of the heat sink arrangement tool oppositely, and the optical device wafer where the heat sink is joined to the optical device layer is cut along the street for dividing into individual optical devices. <P>COPYRIGHT: (C)2010,JPO&INPIT |
