发明名称 THERMOSETTING RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin molding material having excellent mechanical strength, heat-resistance, dimensional accuracy and moldability of thin-walled articles without lowering electrical insulation and imparted with extremely high thermal conductivity compared with conventional materials. SOLUTION: The thermosetting resin molding material contains 10-40 wt.% thermosetting resin, 5-30 wt.% wollastonite and 40-80 wt.% alumina therein. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009221308(A) 申请公布日期 2009.10.01
申请号 JP20080065815 申请日期 2008.03.14
申请人 SUMITOMO BAKELITE CO LTD 发明人 SHINDO TOSHIO;KOIZUMI KOJI;KOBAYASHI SHINICHIRO
分类号 C08L101/00;C08K3/22;C08K3/34 主分类号 C08L101/00
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