ADHESIVE FILM COMPOSITION FOR SEMICONDUCTOR ASSEMBLY, ADHESIVE FILM USING THE SAME AND DICING DIE BONDING FILM COMPRISING THE SAME

摘要

PURPOSE: An adhesive film composition for a semiconductor assembly is provided to suppress the generation of burr in dicing by controlling storage modulus before hardening and to prevent damage of products caused by chip crack generated by chipping. CONSTITUTION: An adhesive film composition for a semiconductor assembly includes an elastomeric resin, a film-forming resin, an epoxy-based resin, a phenol hardener, a curing catalyst, a silane coupling agent and inorganic filler. The elastomeric resin contains a hydroxyl group or carboxy group, and an epoxy group. The adhesive film is formed by the composition. A Dicing Die Bonding Film is such that a tackifier layer(2) and an adhesive layer(3) on a base film.