| 摘要 |
PURPOSE: A method of fabricating a semiconductor package is provided to prevent a failure of a work such as bending, lifting bonding of the semiconductor chip in forming a semiconductor package. CONSTITUTION: A method of fabricating a semiconductor package is comprised of the steps: backing-grinding a wafer(104); adhering back-ground wafer on a wafer ring so that the back-ground bottom is exposed to the upper part; forming an insulating material(110) on the bottom of a wafer; and separating the wafer in which the insulating material is formed from a wafer ring.
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