| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a TAB tape and a method for producing the same, which do not produce residual copper pieces and metallic foreign bodies causing an electrical short circuit failure in conductive layers of both faces, even when a punching operation for cutting to individual pieces is performed using a conventional highly accurate precision metal mold or a metal mold having less processing accuracy. <P>SOLUTION: The TAB tape 1 includes a wiring layer and a GND layer 11 having outer lead parts 7, 8 as conductive layers consisting of copper foils on both top and bottom faces of an insulative film substrate 2, and semiconductor elements (not shown) mounted at each predetermined position in the longitudinal direction of the insulative film substrate 2 and configured to be made into individual pieces by cutting at the predetermined punching-out line 4 (a punching-out part) by the metallic mold, wherein the conductive layers such as GND layer 11 are formed by avoiding the punching-out line 4 in both top and bottom faces of the TAB tape 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
