SEMICONDUCTOR DEVICE, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor device (1) is provided with a multilayer wiring board (4) and a semiconductor chip (2) mounted on the multilayer wiring board (4). Electrode pads (3) of the semiconductor chip (2) are composed of first electrode pads (3a) which include electrode pads arranged in proximity to respective corners of a rear surface (2a) of the semiconductor chip (2), and other second electrode pads (3b). Connecting pads (5) on the multilayer wiring board (4) are composed of first connecting pads (5a) connected to the first electrode pads (3a) through bumps (7), and second connecting pads (5b) connected to the second electrode pads (3b) through the bumps (7). The first connecting pads (5a) are supported by a first insulating region (41) composed of a thermoplastic resin, and the second connection pads (5b) are supported by a second insulating region (42) composed of a thermosetting resin.