LED PACKAGING DEVICE AND METHOD

摘要

PURPOSE: An LED packaging device and method are provided to replace easily the LED chip by replacing only the LED chip die. CONSTITUTION: The packaging method of the light emitting diode comprises as follows. The LED packaging device is prepared. The chip die having the LED chip is inserted between the side support and upper support. The LED packaging device has the supporting plate(110), the side supporter(132,134), and the upper support(140). The supporting plate includes the lower point of contact connected to the lower part of the chip die in which the LED chip is adhered. The side support pressures and supports the side of the chip die. The upper support includes the upper contact point connected to the top surface of the LED chip.