| 摘要 |
PURPOSE: A heater block for a wire bonder is provided to maximize the heat transmission efficiency to a lead frame for facilitating a wire bonding. CONSTITUTION: A heater block for a wire bonder includes a metal block(100), a ceramic block(200), and a square fixing protrusive frame(300). The metal block is heated by the heater. The ceramic block is fixed in the upper part of the metal block. The lead frame mounting a semiconductor chip in the chip mounting plate is received in the upper part of the lead frame. The ceramic block transmits the heat to the semiconductor chip and the lead frame from the metal block. |
