PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to remove an interlayer separation problem between an insulating layer and a copper conductor layer when mounting a semiconductor chip at high temperature, thereby improving reliability of the printed circuit board. CONSTITUTION: A manufacturing method of a printed circuit board comprises the following steps. An insulating layer(20) is provided. In one surface of the insulating layer, an organic film(30) is coated. The first circuit pattern(60) is covalent-bonded with the organic film in one surface of a coated insulating layer. The second circuit pattern(10) is formed in another surface of the insulating layer. A step for forming the first circuit pattern comprises the following steps. A via hole is processed to expose a part of the second circuit pattern before coating the organic film. A seed layer is formed in one surface of the insulating layer after coating the organic film. A seed layer is electroplated by an electrode to form a plating layer. The plating layer is selectively etched.