| 摘要 |
<p>A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ {(CH 2 =CH)R 1 2 SiO 1/2 } L (R 1 SiO 3/2 ) m (R 1 2 SiO) n {O 1/2 SiR 1 2 -R 2 -SiR 1 (3-a) (OR 3 ) a } o €ƒ€ƒ€ƒ€ƒ€ƒ(1)
wherein R 1 represents monovalent hydrocarbon groups, R 2 represents an oxygen atom or a bivalent hydrocarbon group, R 3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o = 2 and R 2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties</p> |
