发明名称 |
Mounting arrangement for light emitting diodes |
摘要 |
A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.
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申请公布号 |
US7594740(B2) |
申请公布日期 |
2009.09.29 |
申请号 |
US20070842145 |
申请日期 |
2007.08.21 |
申请人 |
PEMLIGHT PRODUCTS, INC. |
发明人 |
POPOVICH JOHN;HONEGGER GREGORY W. |
分类号 |
F21V33/00;H05K1/02;H05K3/00 |
主分类号 |
F21V33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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