发明名称 MICROFLUIDIC DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 PURPOSE: A microfluidic device and a method for fabricating the same are provided to improve bonding reliability by suppressing the formation of air bubbles when bonding two substrates using an adhesive. CONSTITUTION: A microfluidic device includes a microflow structure(20), a lower plate protrusion pattern(30), and an adhesive layer. A platform includes an upper and lower plates(12,14) which are bonded with each other. The microflow structure is formed by grooves on the lower plate. The lower plate protrusion pattern includes an outer protrusion of a structure. The outer protrusion of the structure is protruded from the lower substrate to the upper substrate along the outer circumstance of the microflow structure. The adhesive layer is interposed between the lower plate protrusion pattern and upper plate.
申请公布号 KR100919400(B1) 申请公布日期 2009.09.29
申请号 KR20080032178 申请日期 2008.04.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JONG MYEON;LEE, JEONG GUN
分类号 B01L99/00;G01N35/00 主分类号 B01L99/00
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