发明名称 |
Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus |
摘要 |
A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating member 13. The depressing member 15 includes: leg portions 15b which are disposed so as to leave spaces between the leg portions and both side faces 13a of the vibrating member 13 parallel with a vibration direction A; and supporting portions 15c through which the leg portions 15b and the side faces 13a of the vibrating member 13 are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions 15c parallel with the side face 13a of the vibrating member 13, a length L2 along the vibration direction A of the vibrating member 13 is shorter than a length L1 along a depressing direction B of the depressing member 15.
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申请公布号 |
US7595582(B2) |
申请公布日期 |
2009.09.29 |
申请号 |
US20050143646 |
申请日期 |
2005.06.03 |
申请人 |
FUJITSU LIMITED |
发明人 |
OZAKI YUKIO;KASUGA TOSHINORI |
分类号 |
H01L41/053 |
主分类号 |
H01L41/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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