| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, since a reflection-preventing film having the same film thickness is provided on a photodiode part, the reflection on the upper surface of a light receiving part is not effectively suppressed depending on wavelength of the light that is received. SOLUTION: The solid-state image pickup device includes a semiconductor substrate 100, and a first light receiving part is formed in a first region of the semiconductor substrate 100. Further, the solid-state image pickup device includes a first reflection preventing layer 113a which prevents reflection of light on the upper surface of the first light receiving part, with no rough formed on the upper surface of the first reflection preventing layer 113a. COPYRIGHT: (C)2009,JPO&INPIT
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