| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device that suppresses or prevents the disturbance of an air current on a substrate. SOLUTION: The substrate processing device includes: a substrate rotating means for rotating a wafer W on a predetermined axis C1 of rotation; and a plurality of gas discharge nozzles that discharge gas toward the principal surface of the wafer W rotated by the substrate rotating means and to the downstream side of the wafer W in a direction of rotation by the substrate rotating means to form an air current on the principal surface of the wafer W in the direction of rotation of the wafer W. The velocity of the air current formed on the wafer W is equal to the peripheral speed of the wafer W at respective positions different in distances from the axis C1 of rotation of the wafer W. COPYRIGHT: (C)2009,JPO&INPIT
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