WAFER CLEANING EQUIPMENT AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide wafer cleaning equipment which can remove polymer or contamination surely with chemical or deionized water, and to provide a production process of a semiconductor device. SOLUTION: Wafer cleaning equipment comprises a wafer holding mechanism 1 for holding a semiconductor wafer 3, a rotary mechanism for rotating the wafer holding mechanism 1, a chemical nozzle 5 or a deionized water nozzle 4 provided above the wafer holding mechanism 1 and delivering chemical or deionized water to the surface of the semiconductor wafer 3, and a chemical holding tool 6 arranged on the outside of the wafer holding mechanism 1 to cover the bevel portion of the semiconductor wafer 3 and holding the chemical or deionized water temporarily at the bevel portion. COPYRIGHT: (C)2009,JPO&INPIT