| 摘要 |
PROBLEM TO BE SOLVED: To provide a low dielectric insulating material and a method for producing it which can be molded by transfer molding, press-in molding, and injection molding, has a dielectric constant of 2.9 or less, and is excellent in adhesiveness with metal, drilling workability, sliding properties, and heat resistance. SOLUTION: The low dielectric insulating material is a thermoset product of a solventless resin kneaded material consisting of 20-50 vol% of a thermosetting resin component and 80-50 vol% of fluororesin powder. The method for producing the low dielectric insulating material includes a solventless resin kneaded material preparation process for blending 20-50 vol% of the liquid thermosetting resin component and 80-50 vol% of the fluororesin powder together and kneading the mixture in a vacuum condition without using any solvent to prepare the solventless resin kneaded material including no bubble, and a thermosetting process for thermosetting the solventless resin kneaded material to obtain the low dielectric insulating material. COPYRIGHT: (C)2009,JPO&INPIT |
