发明名称 |
MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes is formed to penetrate each of the resin insulating layers, and a filled via conductor for electrically connecting the conductor layers is formed in the via holes respectively. A tip of the glass cloth contained in each of the resin insulating layers is protruded from an internal wall surface of the via hole and cuts into a sidewall of the filled via conductor.
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申请公布号 |
US2009236138(A1) |
申请公布日期 |
2009.09.24 |
申请号 |
US20090403535 |
申请日期 |
2009.03.13 |
申请人 |
KATAGIRI HIROSHI;ASANO TOSHIYA |
发明人 |
KATAGIRI HIROSHI;ASANO TOSHIYA |
分类号 |
H05K1/11;H05K3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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