WAFER HOLDING BODY, AND SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wafer holding body capable of remarkably improving a cooling speed of a wafer placing base and improving also a temperature increasing speed, and to provide a semiconductor manufacturing apparatus loaded with the wafer holding body. SOLUTION: The wafer holding body includes: the wafer placing base provided with a wafer placing surface for placing a wafer and a heating body; a wafer placing base supporting body for supporting the wafer placing base from the opposite side to the wafer placing surface; and a cooling medium jet module for jetting a cooling medium to the opposite side surface of the wafer placing base, which is opposed to the wafer placing surface. The semiconductor manufacturing apparatus is loaded with the wafer holding body. COPYRIGHT: (C)2009,JPO&INPIT