PLACING TABLE STRUCTURE AND HEAT TREATMENT APPARATUS

摘要

Provided is a placing table structure wherein a placing table itself is prevented from breaking by preventing a cool spot from being generated at the center section of the placing table, and uniformity of heat treatment within a surface of a subject to be treated is improved. The placing table structure is arranged in a treating container (22) of a heat treatment apparatus, for placing a semiconductor wafer (W), i.e., the subject to be heat-treated. The placing table structure is provided with a placing table (52) for placing the subject to be treated, and a cylindrical supporting column (54), which is connected to the center section on the lower surface of the placing table and supports the placing table. A heat reflecting section (56) is arranged in proximity to the lower surface of the placing table, in an upper section in the supporting column. The heat reflecting section (56) prevents the cool spot from being generated at the center section of the placing table (54).