INSULATING METAL BASE CIRCUIT BOARD AND HYBRID INTEGRATED CIRCUIT MODULE USING THE SAME

摘要

Provided is a circuit designing method wherein warpage behavior generated due to heat load in a substrate mounting step is reduced. An insulating metal base circuit board using such method, and a hybrid integrated circuit module using such circuit board are also provided. In the insulating metal base circuit board, a circuit takes 50% or more of a conductive metal composed of a circuit section and a non-circuit section, at least on one discretionary cross-section, which passes the gravity center of a circuit-side plane of the insulating metal base circuit board and vertical to the circuit plane, an area of the conductive metal takes 50% or more of the area of the plane of the insulating metal base circuit board, and furthermore, the minimum rectangular area so defined as to include all the circuit sections takes 60% or more of the area of the plane of the insulating metal base circuit board. The insulating metal base circuit board is provided on a metal foil and provided with a conductor circuit with an insulating layer in between.