发明名称 Power controller for a mounting substrate and a semiconductor substrate
摘要 In a power controller for a mounting substrate adapted to mount an integrated circuit includes I/O pads mounted on a semiconductor substrate as the mounting substrate, and a Vcc1 electric circuit system mounted on the semiconductor substrate, an isolator portion is included in the power controller and is connected between one of the I/O pads and the Vcc1 electric circuit system. Another isolator portion may be connected between the other I/O pad and another Vcc3 electric circuit system.
申请公布号 US2009230780(A1) 申请公布日期 2009.09.17
申请号 US20080077178 申请日期 2008.03.17
申请人 TECHNOLOGY ALLIANCE GROUP, INC. 发明人 OYAMADA SEISEI
分类号 H02B1/24;H01H35/00 主分类号 H02B1/24
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