| 摘要 |
A multi-chip Package including power management IC is provided to decrease the pin number and simplify the package design. A plurality of chips(IC#1~IC#5) of different level of the power supply voltage is formed. The single exterior voltage is applied to the power management IC(140) and delivers the required level power supply voltage to a plurality of chips. The power source converting portion(150) receives the single exterior voltage from the power management IC to be converted to the power supply voltage used for a plurality of chips. A plurality of chips requires the power supply voltage of one or more level. The power supply voltage of the required level is delivered to a plurality of chips through the metal layer formed on the silicon substrate(120) of the multi-chip package. The power management IC comprises the first connection means, and the second connection means and the third connection means. |
