METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To manufacture an excellent circuit board which is improved in adhesion between a copper circuit and a base material without causing a plated coating to peel off a substrate. SOLUTION: A method of manufacturing a circuit board includes: a primary plating treatment step of forming a ground plated coating 14a on a base material made of an insulating resin 13; and a secondary plating treatment step of forming a thickened plated coating 14b which is thicker than the ground plated coating 14b on the ground plated coating 14b formed in the primary plating treatment step. In the primary plating treatment step, the plating treatment is carried out using an electroless plating bath for forming the ground plated coating 14a having internal stress in a direction different from the direction of internal stress of the thickened plated coating 14b formed in the secondary plating treatment process. COPYRIGHT: (C)2009,JPO&INPIT