| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition providing excellent coating operability, and having excellent adhesive characteristics to a copper surface while keeping the adhesive characteristics to a silver-plated surface, and to provide a highly reliable semiconductor device hardly causing separation after high-temperature reflow treatment by using the resin composition. <P>SOLUTION: The resin composition contains (A) electroconductive particles, (B) a thermosetting resin, and (C1) a compound having a sulfide bond and an alkoxysilyl group and (C2) a compound having a sulfide bond and a hydroxy group. The adhesive layer and the semiconductor device produced by using the resin composition are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
