Cooling system for power semiconductor arranged on supporting circuit board, particularly for supporting boards equipped with light-emitting diodes, comprises coolant, where sub-coolant lies opposite to rear side of circuit board

摘要

The cooling system comprises a coolant (4) which is designed in multi-segments. A sub-coolant (1) lies opposite to the rear side of a circuit board, where another sub-coolant (2) is spaced from the former sub-coolant which is designed as a flat body provided with the recesses (6). The latter sub-coolant has a lug (5) which extends free from contact through the recesses of the former sub-coolant. A contact area (7) is selected between the sub-coolants and the rear side of the circuit board depending on the positions of the power semiconductor on the circuit board.