FLIP CHIP PACKAGE

摘要

A flip chip package is provided to increase a dimension contacted between a bump and an electrode terminal of a substrate by forming the bump having a concave shape on a semiconductor chip. A substrate(102) includes an electrode terminal(106). A semiconductor chip(114) is attached on one surface of the substrate with a face-down type, and has a bonding pad. An anisotropic conductive adhesive(110) is interposed between the semiconductor chip and the substrate, and has a plurality of conductive particles. A connection part(113) has a concave shape in order to widen a contact dimension with the particle inside the anisotropic conductive adhesive. The connection part is made of a bump. The connection part has a concave shape by a coining mode. The bump includes a gold stud bump.