CHIP BONDING METHOD AND APPARATUS

摘要

A method and a device for bonding a chip on a groove using a laser are provided to increase the production efficiency by loading an anisotropic conductive film on a groove while moving. An anisotropic conductive film paper(10) in which a release paper is adhered to an anisotropic conductive film(10a) and one side is transferred between a first roller(101) and a second roller(102). A plurality of cutting grooves in which the diameter is smaller than the groove is formed in the transferred anisotropic conductive film side into the half cutting part with the punching. The anisotropic conductive film paper, in which a cutting groove is built up, is pitch transferred and the groove and the cutting groove of the materials are arranged.